Microstructure Evolution and Hot Deformation Behavior of a CuNiSn Alloy

The hot deformation behavior of Cu-20.0Ni-5.0Sn-0.25Zn-0.22Mn was investigated using a Gleeble-3500 thermal simulator with temperature range from 720 °C to 880 and strain rate 0.001 s?1 1 s?1. results show that the flow stress increased increase decrease temperature. constitutive equation alloy established based on peak stress. Figures power dissipation efficiency instability variable true 0.2 0.8 displayed dynamic change area. domain 730–770 0.001–0.01 possessed over 40% throughout whole deformation. always appeared at high 0.1 during process. nucleation site recrystallization generally along grain boundaries, indicating discontinuous mechanism. appropriate conditions for 0.9 is in safe (820–860 s?1). There were four kinds variation tendencies under various conditions, suggesting changing situation main softening mechanisms.